碳基集成电路技术研究进展与展望

doi:10.11871/jfdc.issn.2096-742X.2021.05.001

数据与计算发展前沿 ›› 2021, Vol. 3 ›› Issue (5): 4-27.

doi: 10.11871/jfdc.issn.2096-742X.2021.05.001
PID:21.86101.2/JFDC.ISSN.2096.742X.2019.01.012
CSTR:32002.14.jfdc.issn.2096.742X.2019.01.012

• 专刊：我国信息技术领域“卡脖子”问题与对策 • 上一篇下一篇

碳基集成电路技术研究进展与展望

许海涛^1,^*(),彭练矛^2,^*()

1.北京华碳元芯电子科技有限责任公司,北京 100195
2.北京大学,北京 100871

收稿日期:2021-10-01 出版日期:2021-10-20 发布日期:2021-11-24
通讯作者: 许海涛,彭练矛
作者简介:许海涛,北京华碳元芯电子科技有限责任公司CTO,北京元芯碳基集成电路研究院研发部部长,博士。研究方向为碳基集成电路技术及其应用。
本文中负责全文初稿的撰写。
XU Haitao, Ph.D., CTO of Beijing Hua-tan Yuanxin Electronic Technology Co., Ltd. and director of R&D Department of Beijing Institute of Carbon-base Integrated Circuits. His research directions include carbon-based integrated circuit technology and its applications.
In this article, he is responsible for writing the first draft of manuscript.
E-mail: htxu@bicic.cn|彭练矛,北京大学电子系,主任,博士,博士研究生导师,中国科学院院士。主要研究方向为电子显微学和碳基电子学。
本文中负责总体统稿。
PENG Lianmao, Ph.D., is an academi-cian of the Chinese Academy of Sciences, and a doctoral supervisor of Department of Electronics, Peking University. His main research directions include electron microscopy and carbon-based electronics.
In this article, he is responsible for the final compilation and edition of the manuscript.
E-mail: lmpeng@pku.edu.cn
基金资助:
国家自然科学基金委员会基础科学中心项目(61888102)

Carbon-Based Integrated Circuit Technology: Development and Forecast

XU Haitao^1,^*(),PENG Lianmao^2,^*()

1. Beijing Hua Tan Yuan Xin Electronics Technology Co., Ltd., Beijing 100195, China
2. Peking University, Beijing 100871, China

Received:2021-10-01 Online:2021-10-20 Published:2021-11-24
Contact: XU Haitao,PENG Lianmao

摘要/Abstract

摘要：

【目的】人工智能、大数据等领域的发展对芯片算力和能效的要求越来越高,硅基芯片技术受到功耗墙、存储墙和尺寸缩减等限制,面临日益严峻的挑战,需要新的沟道材料和新的芯片架构推动信息电子产业的继续向前,碳纳米管CMOS技术是目前最具潜力的下一代集成电路技术。【方法】针对碳纳米管集成电路发展中需要突破的关键性技术,分别从芯片用碳纳米管材料、碳纳米管晶体管技术和系统集成三个方面,阐述其研究进展,分析其面临的挑战和需要解决的问题。【结果】碳纳米管集成电路技术经过二十多年的发展,在材料、器件和系统集成等方面均取得了重大进步与突破,包括高纯度半导体碳纳米管阵列材料的制备、接近理论极限的高性能弹道碳纳米管晶体管器件、碳纳米管三维单片集成系统等。【结论】碳纳米管是构建场效应晶体管的理想沟道材料,可以实现高速低功耗的弹道输运,结合三维单片集成的架构优化,碳纳米管集成电路技术在性能、功耗、面积、功能集成、成本等方面将展现出巨大的优势,满足未来信息处理对芯片的需求。

关键词: 碳纳米管, 晶体管, 集成电路, 弹道输运, 三维单片集成

Abstract:

[Objective] The development of artificial intelligence, big data, and other fields has increasingly higher requirements for chip computing power and energy efficiency. Silicon-based chip technology is restricted by the power wall, storage wall, and size reduction, and is facing increasingly severe challenges. New materials and new chip architectures are needed to push the information and electronics industry forward. Carbon nanotube CMOS technology is currently the most promising next-generation integrated circuit technology. [Methods] Aiming at addressing the key technologies that need to be broken through in the development of carbon nanotube integrated circuits from three aspects: preparation of carbon nanotube materials for chips, carbon nanotube transistor technology and system integration. The research progress is elaborated, and the challenges and next steps are analyzed. [Results] After more than 20 years of development in carbon nanotube integrated circuit technology, major progress and breakthroughs have been made in materials, devices and system integration, including the preparation of high-purity semiconductor carbon nanotube arrays, high-performance ballistic transport carbon nanotube transistors close to the theoretical limit and carbon nanotube three-dimensional monolithic integrated systems, etc. [Conclusions] Carbon nanotubes are ideal channel materials for field-effect transistors, which can achieve high-speed and low-power ballistic transport. Combined with the architecture optimization of three-dimensional monolithic integration, carbon nanotube integrated circuit technology will show great advantages and potential in terms of performance, power consumption, chip area, function integration, cost, etc., and meet the needs of future information processing for chips.

Key words: carbon nanotube, field effect transistor, integrated circuit, ballistic transport, three dimensional monolithic integration

许海涛,彭练矛. 碳基集成电路技术研究进展与展望[J]. 数据与计算发展前沿, 2021, 3(5): 4-27.

XU Haitao,PENG Lianmao. Carbon-Based Integrated Circuit Technology: Development and Forecast[J]. Frontiers of Data and Computing, 2021, 3(5): 4-27.

图/表 19

图1

图2

图3

图4

图5

图6

图7

图8

图9

图10

图11

图12

图13

图14

图15

图16

图17

图18

图19

参考文献 61

[1]	Cao Q. Carbon nanotube transistor technology for More-Moore scaling[J]. Nano Res. 2021, 14:3051-3069. doi: 10.1007/s12274-021-3459-z
[2]	Ronald G. Dreslinski, Michael Wieckowski, et al. Near threshold computing: overcoming performance degrad-ation from aggressive voltage Scaling[D]. In Proc. ISCA Workshop on Energy-Efficient Design, 2009.
[3]	H.-S. Philip Wong. Carbon Nanotube Digital Nanosy-stems[D]. PKU CNT Workshop, 2015.
[4]	Tathagata Srimani, G. Hills, M.M. Shulaker, et al. Heter-ogeneous integration of BEOL logic and memory in a commercial foundry: multi-tier complementary carbon nanotube logic and resistive RAM at a 130 nm node[J]. VLSI, 2020, 9265083.
[5]	Aaron Franklin. Nanomaterials in transistors: From high-performance to thin-film applications[J]. Science, 2015, 349:6249
[6]	Frank Schwierz. Graphene transistors[J]. Nat. Nano-technol., 2010, 5:487.
[7]	F Yang et al. Chirality-specific growth of single-wall- ed carbon nanotubes on solid alloy catalysts[J]. Nature, 2014, 510:522-524. doi: 10.1038/nature13434
[8]	Shuchen Zhang, Zhang Jin, et al. Arrays of horizontal carbon nanotubes of controlled chirality grown using designed catalysts[J]. Nature, 2017, 543:234-238. doi: 10.1038/nature21051
[9]	Jin S., Dunham S., Song J. et al. Using nanoscale thermocapillary flows to create arrays of purely semicon-ducting single-walled carbon nanotubes[J]. Nature Nanotech., 2013, 8:347-355. doi: 10.1038/nnano.2013.56
[10]	A. A. Green, M. C. Hersam. Nearly single-chirality single-walled carbon nanotubes produced via orthogonal iterative density gradient ultracentrifugation[J]. Adv. Mater., 2011, 23:2185. doi: 10.1002/adma.v23.19
[11]	S. Ghosh, S. M. Bachilo, R. B. Weisman. Advanced sorting of single-walled carbon nanotubes by nonlin-ear density-gradient ultracentrifugation[J]. Nat. Nanote-chnol., 2010, 5:443.
[12]	J. A. Fagan, M. Zheng, et al. Isolation of specific small-diameter single-wall carbon nanotube species via aque-ous two-phase extraction[J]. Adv. Mater., 2014, 26:2800. doi: 10.1002/adma.v26.18
[13]	H. Gui, J. K. Streit, M. Zheng, et al. Redox sorting of carbon nanotubes[J]. Nano Lett., 2015, 15:1642. doi: 10.1021/nl504189p
[14]	Huiliang Wang, Zhenan Bao. Conjugated polymer sorting of semiconducting carbon nanotubes and their electronic applications[J]. Nano Today, 2015, 10:737-758. doi: 10.1016/j.nantod.2015.11.008
[15]	Qiu S., Li Q. W., et al. Solution-processing of high-purity semiconducting single-walled carbon nanotubes for electronics devices[J]. Adv. Mater., 2019, 31:1800750. doi: 10.1002/adma.v31.9
[16]	Liyuan Liang, Wanyi Xie, Song Qiu, Qingwen Li, et al. High-efficiency dispersion and sorting of single-walled carbon nanotubes via non-covalent interactions[J]. J. Mater. Chem. C, 2017, 5:11339-11368. doi: 10.1039/C7TC04390B
[17]	Darryl Fong, Alex Adronov. Recent developments in the selective dispersion of single-walled carbon nanotubes using conjugated polymers[J]. Chem. Sci., 2017, 8:7292-7305. doi: 10.1039/c7sc02942j pmid: 29163880
[18]	Mistry K.S B.A. Larsen, and J.L. Blackburn. High-yield dispersions of large-diameter semiconducting single-walled carbon nanotubes with tunable narrow chirality distributions[J]. ACS Nano, 2013, 7(3):2231-2239. doi: 10.1021/nn305336x pmid: 23379962
[19]	Gu J.T., J. Han, D. Liu, X.Q. Yu, L.X. Kang, S. Qiu, H.H. Jin, H.B. Li, et al. Solution-processable high-purity semiconducting SWCNTs for large-area fabrication of high-performance thin-film transistors[J]. Small, 2016, 12(36):4993-4999. doi: 10.1002/smll.201600398
[20]	Liu L, Peng LM. et al. Aligned, high-density semicon-ducting carbon nanotube arrays for high-performance electronics[J]. Science, 2020, 368:850-856. doi: 10.1126/science.aba5980
[21]	Lei T, Chen X, Pitner G, Wong HS, Bao Z. Removable and recyclable conjugated polymers for highly selective and high-yield dispersion and release of low-cost carbon nanotubes[J]. J. Am. Chem. Soc., 2016, 138(3):802-805. doi: 10.1021/jacs.5b12797
[22]	Park H., Afzali A., Han SJ. et al. High-density integr-ation of carbon nanotubes via chemical self-assembly[J]. Nature Nanotech., 2012, 7:787-791. doi: 10.1038/nnano.2012.189
[23]	Sun W, Shen J, Yin P. et al. Precise pitch-scaling of carbon nanotube arrays within three-dimensional DNA nanotrenches[J]. Science, 2020, 368(6493):874-877. doi: 10.1126/science.aaz7440
[24]	Cao Q., Han Sj., Tulevski G. et al. Arrays of single-walled carbon nanotubes with full surface coverage for high-performance electronics[J]. Nat. Nanotechnol., 2013, 8:180-186. doi: 10.1038/nnano.2012.257
[25]	Jinkins K. R., Chan J., Jacobberger R. M., Berson A., Arnold M. S. Substrate‐wide confined shear alignment of carbon nanotubes for thin film transistors[J]. Adv. Electron. Mater., 2019, 5:1800593. doi: 10.1002/aelm.v5.2
[26]	Yongho Joo, Michael S. Arnold, Padma Gopalan et al. Dose-controlled, floating evaporative self-assembly and alignment of semiconducting carbon nanotubes from organic solvents[J]. Langmuir, 2014, 30(12):3460-3466. doi: 10.1021/la500162x pmid: 24580418
[27]	He X., Gao W., Xie L. et al. Wafer-scale monodomain films of spontaneously aligned single-walled carbon nanotubes[J]. Nat. Nanotechnol., 2016, 11:633-638. doi: 10.1038/nnano.2016.44
[28]	Katherine R. Jinkins, Padma Gopalan, Michael S. Arnold, et al. Nanotube alignment mechanism in floating evaporative self-assembly[J]. Langmuir, 2017, 33:13407-13414. doi: 10.1021/acs.langmuir.7b02827 pmid: 29058446
[29]	Shi H., Ding L., Zhong D. et al. Radiofrequency transistors based on aligned carbon nanotube arrays[J]. Nat. Electron. 2021, 4:405-415. doi: 10.1038/s41928-021-00594-w
[30]	Katherine R. Jinkins, Padma Gopalan, Michael S. Arnold, et al. Aligned 2D carbon nanotube liquid crystals for wafer-scale electronics[J]. Sci. Adv., 2021, 7:eabh0640. doi: 10.1126/sciadv.abh0640
[31]	Javey A., Guo J., Wang Q., Lundstrom M., and Dai H. J. Ballistic carbon nanotube fieldeffect transistors[J]. Nature, 2003, 424:654-657. doi: 10.1038/nature01797
[32]	Javey A., Wang Q., Kim W., and Dai H. Advancements in complementary carbon nanotube field-effect transistors[J]. IEDM, 2003, 1269387.
[33]	Zhihong Chen, Phaedon Avouris et al. The role of metal-nanotube contact in the performance of carbon nanotube field-effect Ttransistors[J]. Nano Lett., 2005, 5(7):1497-1502. pmid: 16178264
[34]	Zhang Z, Liang X, Wang S, et al. Doping-free fabrication of carbon nanotube based ballistic CMOS devices and circuits[J]. Nano Lett, 2007, 7:3603-3607. doi: 10.1021/nl0717107
[35]	Zhiyong Zhang, Lianmao Peng et al. Almost Perfectly Symmetric SWCNT-Based CMOS Devices and Scaling[J]. ACS Nano., 2009, 3(11):3781-3787. doi: 10.1021/nn901079p
[36]	Lee C. S.; Pop E.; Franklin A. D.; Haensch W.; Wong H. S. P. A compact virtual-source model for carbon nanotube FETs in the sub-10-nm regime—Part I: Intrinsic elements[J]. IEEE Trans. Electron Devices, 2015, 62:3061-3069. doi: 10.1109/TED.2015.2457453
[37]	Chenguang Qiu, Zhiyong Zhang, Lianmao Peng, et al. Scaling carbon nanotube complementary transistors to 5-nm gate lengths[J]. Science, 2017, 355:271-276. doi: 10.1126/science.aaj1628 pmid: 28104886
[38]	Aaron D, Franklin, Wilfried Haensch et al. Carbon Nanotube Complementary Wrap-Gate Transistors[J]. Nano Lett., 2013, 13:2490-2495. doi: 10.1021/nl400544q pmid: 23638708
[39]	Franklin A D, Chen Z. Length scaling of carbon nanotube transistors[J]. Nat. Nanotechnol., 2010, 5:858-862 doi: 10.1038/nnano.2010.220 pmid: 21102468
[40]	Berger H. H. Models for contacts to planar devices[J]. Solid State Electron. 1972, 15:145-158. doi: 10.1016/0038-1101(72)90048-2
[41]	Solomon P. M. Contact resistance to a one-dimensional quasi-ballistic nanotube/wire[J]. IEEE Electron Device Lett., 2011, 32:246-248. doi: 10.1109/LED.2010.2095821
[42]	Gregory Pitner, H.-S. Philip Wong, et al. Low-tem-perature side contact to carbon nanotube transistors: resistance distributions down to 10 nm contact length[J]. Nano Lett., 2019, 19:1083-1089. doi: 10.1021/acs.nanolett.8b04370 pmid: 30677297
[43]	Cao Q.; Han S. J.; Haensch W. et al. End-bonded contacts for carbon nanotube transistors with low, size-independent resistance[J]. Science, 2015, 350:68-72. doi: 10.1126/science.aac8006
[44]	Tang J. S., Cao Q., Han S. J. et al. Carbon nanotube complementary logic with low-temperature processed end-bonded metal contacts[J]. IEDM, 2016, 7838350.
[45]	Cao Q., Tersoff J., Han S. J. et al. Carbon nanotube tr-ansistors scaled to a 40-nanometer footprint[J]. Science, 2017, 356:1369-1372. doi: 10.1126/science.aan2476
[46]	Lu Y, Bangsaruntip S, Wang X, et al. DNA function-alization of carbon nanotubes for ultrathin atomic layer deposition of high κ dielectrics for nanotube transistors with 60 mV/Decade switching[J]. J. Am. Chem. Soc., 2006, 128:3518-3519. doi: 10.1021/ja058836v
[47]	Wang Z, Xu H, Zhang Z, et al. Growth and performance of yttrium oxide as an ideal high-κ gate dielectric for carbon-based electronics[J]. Nano Lett., 2010, 10:2024-2030. doi: 10.1021/nl100022u
[48]	G. Pitner, Z. Zhang, Q. Lin, et al. Sub-0.5 nm Interfacial Dielectric Enables Superior Electrostatics: 65 mV/dec Top-Gated Carbon Nanotube FETs at 15 nm Gate Length[J]. IEDM 2020, 9371899.
[49]	Shulaker M M, Hills G, Patil N, et al. Carbon nanotube computer[J]. Nature, 2013, 501:526-530. doi: 10.1038/nature12502
[50]	Yang Y, Ding L, Peng LM, et al. High-Performance Complementary Transistors and Medium-Scale Integrated Circuits Based on Carbon Nanotube Thin Films[J]. ACS Nano, 2017, 11:4124-4132. doi: 10.1021/acsnano.7b00861
[51]	Hills G, Lau C, Max M, Shulaker, et al. Modern mic-roprocessor built from complementary carbon nanotube transistors[J]. Nature, 2019, 572:595-602. doi: 10.1038/s41586-019-1493-8
[52]	Bishop M. D.; Hills G; M.; Shulaker M. M. et al. Fabrication of carbon nanotube field-effect transistors in commercial silicon manufacturing facilities[J]. Nat. Electron., 2020, 3, 492-501. doi: 10.1038/s41928-020-0419-7
[53]	Shulaker MM, Wong HSP, Mitra S, et al. Monolithic 3D integration of logic and memory: carbon nanotube FETs, resistive RAM, and silicon FETs[J]. IEDM, 2014, 7047120.
[54]	Shulaker M. M., Hills G., Wong H. S. P., et al. Threedi-mensional integration of nanotechnologies for computing and data storage on a single chip[J]. Nature, 2017, 547:74-78. doi: 10.1038/nature22994
[55]	Wu TF, Li H, Wong HSP, Shulaker MM, Mitra S. et al. Hyperdimensional Computing Exploiting Carbon Nano-tube FETs, Resistive RAM, and Their Monolithic 3D Integration[J]. IEEE J. Solid-State Circuits, 2018, 53:3183-3196. doi: 10.1109/JSSC.2018.2870560
[56]	T Srimani, G Hills, C Lau, M Shulaker. Monolithic Three-Dimensional Imaging System: Carbon Nanotube Computing Circuitry Integrated Directly Over Silicon Imager[J]. VLSI, 2019, 8776514.
[57]	Zhong D., Zhang Z., Ding L. et al. Gigahertz integrated circuits based on carbon nanotube films[J]. Nat. Electron., 2018, 1:40-45. doi: 10.1038/s41928-017-0003-y
[58]	Tang J., Farmer D.B., Bangsaruntip S. et al. Contact engineering and channel doping for robust carbon nano-tube NFETs[J]. VLSI-TSA, 2017, 7942478.
[59]	Lau C., Srimani T., Bishop M. D., Hills G., Shulaker M. M. Tunable n-type doping of carbon nanotubes through engineered atomic layer deposition HfOx films[J]. ACS Nano, 2018, 12:10924-10931. doi: 10.1021/acsnano.8b04208
[60]	L. S. Liyanage, H.-S. Philip Wong, et al. VLSI-Compat-ible Carbon Nanotube Doping Technique with Low Work- Function Metal Oxides[J]. Nano Lett., 2014, 14(4):1884-1890. doi: 10.1021/nl404654j
[61]	H.-S. Philip Wong. The Next Technology for 21^st Century Computing[J]. PKU CNT Workshop, 2017.

碳基集成电路技术研究进展与展望

Carbon-Based Integrated Circuit Technology: Development and Forecast

RichHTML

PDF

可视化

摘要/Abstract

引用本文

使用本文

图/表 19

参考文献 61

相关文章 3

编辑推荐

Metrics

本文评价

[1]	张睿,虞小鹏,程然,沈强,耿红艳,高大为,吴汉明. 集成电路先进制造技术进展与趋势[J]. 数据与计算发展前沿, 2021, 3(5): 28-39.
[2]	陈磊,赵聪鹏,葛婕,左璇. 全球集成电路技术与产业发展实践与创新发展趋势[J]. 数据与计算发展前沿, 2021, 3(5): 55-64.
[3]	余丽,盛莹婕,许景龙,隋秀峰. 专利分析视角下我国集成电路产业“卡脖子”问题研究[J]. 数据与计算发展前沿, 2021, 3(5): 40-54.