太赫兹通信芯片关键技术与系统发展浅析

doi:10.11871/jfdc.issn.2096-742X.2021.05.006

数据与计算发展前沿 ›› 2021, Vol. 3 ›› Issue (5): 82-97.

doi: 10.11871/jfdc.issn.2096-742X.2021.05.006

• 专刊：我国信息技术领域“卡脖子”问题与对策 • 上一篇下一篇

太赫兹通信芯片关键技术与系统发展浅析

曹浩一¹(),董亚洲¹(),王正¹(),寇伟¹(),张倩玉¹(),童钦文¹(),杨自强^1,²(),龚森^1,²(),曾泓鑫¹(),张雅鑫^1,^2,^*()

1.电子科技大学,四川成都 611731
2.电子科技大学长三角研究院(湖州),浙江湖州 313099

收稿日期:2021-10-01 出版日期:2021-10-20 发布日期:2021-11-24
通讯作者: 张雅鑫
作者简介:曹浩一,电子科技大学,本科,主要研究方向为太赫兹MIMO通信系统和信道建模。
本文中负责大规模MIMO撰写和初稿整合。
CAO Haoyi is an undergraduate at the University of Electronic Science and technology. His main research interests include Terahertz MIMO communication system and channel modeling.
In this paper, he is responsible for writing the large-scale MIMO section and integration of the first draft.
E-mail: 2018120708028@std.uestc.edu.cn|董亚洲,电子科技大学,博士,主要研究方向为太赫兹固态器件。
本文中负责太赫兹分立器件撰写。
DONG Yazhou, is a Ph.D. of the Univer-sity of Electronic Science and technolo-gy. His main research interests include Terahertz solid state devices.
In this paper, he is responsible for writing the terahertz discrete devices section.
E-mail: 514953505@qq.com|王正,电子科技大学,硕士研究生,主要研究方向为太赫兹通信系统架构。
在本文中负责频分复用部分。
WANG Zheng is a graduate student at the University of Electronic Science and technology. His main research interests include Terahertz communication system architecture.
In this paper, he is responsible for the frequency division multiplexing part.
E-mail: 627620644@qq.com|寇伟,电子科技大学,博士,主要研究方向为太赫兹超表面和固态器件。
本文中负责太赫兹分立器件。
KOU Wei is a Ph.D. at the University of Electronic Science and technology. His main research interests include Terahertz super surface and solid-state devices.
In this paper, he is responsible for terahertz discrete devices.
E-mail: 1973877445@qq.com|张倩玉,电子科技大学,硕士研究生,主要研究方向为InP HEMT开关、倍频芯片以及芯片封装等。
本文中负责InP、GaN集成芯片的调研。
ZHANG Qianyu is a graduate student at the University of Electronic Science and technology. Her main research interests include InP HEMT switch, frequency doubling chip, and chip packaging.
In this paper, she is responsible for the investigation of InP and Gan integrated chips.
E-mail: qyzhang6@163.com|童钦文,电子科技大学,硕士研究生,主要研究方向为毫米波与太赫兹通信集成电路。
本文中负责硅基太赫兹芯片的调研。
TONG Qinwen is a graduate student at the University of Electronic Science and technology. His main research interests include Millimeter wave and terahertz communi-cation integrated circuits.
In this paper, he is responsible for the investigation of silicon-based terahertz chip.
E-mail: tonqw@outlook.com|杨自强,电子科技大学,博士,研究员,美国哥伦比亚大学访问学者,主要研究方向为毫米波太赫兹技术。
本文中负责太赫兹芯片。
YANG Ziqiang, Ph.D., is a researcher in the University of Electronic Science and technology and visiting scholar of Columbia University. His main research interests include Millimeter wave terahertz technology.
In this paper, he is responsible for terahertz chip.
E-mail: yangziqiang@uestc.edu.cn|龚森,电子科技大学电子科学与工程学院,博士,副研究员,主要研究方向为太赫兹射频器件与系统。本文中复杂太赫兹感通一体与微波光子学部分。
GONG Sen, Ph.D., is an associate resear-cher in the School of Electronic Science and engineering, the University of Electronic Science and technology of China. His main research interests include Terahertz RF devices and systems.
In this paper, he is responsible for the integration of complex terahertz sensing and microwave photonics.
E-mail: gongsen@uestc.edu.cn|张雅鑫,电子科技大学,博士,博士生导师,教授,主要研究方向为太赫兹高速调控及通信技术。
本文中负责文章结构梳理和内容讨论。
ZHANG Yaxin, Ph.D., is a doctoral supervisor and full professor in the University of Electronic Science and technology. His main research interests include Terahertz high-speed regulation and communication tech-nology.
In this paper, he is responsible for combing the structure and discussing the content of the article.
E-mail: zhangyaxin@uestc.edu.cn|张雅鑫,电子科技大学,博士,博士生导师,教授,主要研究方向为太赫兹高速调控及通信技术。
本文中负责文章结构梳理和内容讨论。
ZHANG Yaxin, Ph.D., is a doctoral supervisor and full professor in the University of Electronic Science and technology. His main research interests include Terahertz high-speed regulation and communication tech-nology.
In this paper, he is responsible for combing the structure and discussing the content of the article.
E-mail: zhangyaxin@uestc.edu.cn

Analysis of Key Technology of Terahertz Communication Chip and Development of Communication System

CAO Haoyi¹(),DONG Yazhou¹(),WANG Zheng¹(),KOU Wei¹(),ZHANG Qianyu¹(),TONG Qinwen¹(),YANG Ziqiang^1,²(),GONG Sen^1,²(),ZENG Hongxin¹(),ZHANG Yaxin^1,^2,^*()

1. University of Electronic Science and Technology of China, Chengdu, Sichuan 611731, China
2. Yangtze Delta Region Institute (Huzhou), University of Electronic Science and Technology of China, Huzhou, Zhejiang 313099, China

Received:2021-10-01 Online:2021-10-20 Published:2021-11-24
Contact: ZHANG Yaxin

摘要/Abstract

摘要：

【目的】现代无线通信低频频谱资源越来越紧张,但太赫兹频段具有丰富的频谱资源,太赫兹通信兼具大带宽、高保密性等优势,故成为下一代无线通信技术的重要候选技术,而其关键在于太赫兹芯片。【方法】本文主要介绍太赫兹芯片技术及基于芯片的通信技术,对其从基于肖特基二极管芯片的混频、倍频分立式器件到太赫兹芯片的现有成果和未来发展趋势到未来太赫兹通信系统的技术发展和应用场景进行浅析。【结果】基于肖特基二极管的太赫兹分立器件如倍频器、混频器在不断朝高频段、大带宽以及高集成度发展。对芯片而言,基于磷化铟(InP)、砷化镓(GaAs)、氮化镓(GaN)、硅基技术的芯片都在朝着大功率、高频率、高集成度的方向发展,并且未来有望形成InP工艺和GaN工艺配合发展的格局。【结论】在未来,基于芯片技术的太赫兹通信系统可以朝向大规模频分复用、大规模MIMO技术、感通一体、光电融合,以及将频分、极化等多技术融合的复杂复用系统方向发展。我们也希望通过本综述来和读者探讨、畅想太赫兹芯片的发展趋势和基于太赫兹芯片技术的通信系统发展方向。

关键词: 太赫兹通信, 太赫兹芯片, 太赫兹通信系统, 频分复用, 大规模MIMO, 感通一体, 光电融合, 复杂复用系统

Abstract:

[Objective] With the increasing shortage of low-frequency spectrum resources in modern wireless communication, the terahertz band which is rich in spectrum resources and terahertz communication which has larger bandwidth and higher confidentiality have shown their advantage. It has become the key candidate of the next generation wireless communication technology with its core in terahertz chip. [Methods] This paper mainly introduces terahertz chip technology and chip-based communication technology. We will start from the key terahertz chips and devices, analyzing the existing achievements and future development trend of discrete devices based on Schottky diode chips, like mixer and frequency multiplier, to terahertz chips and consider the technical development trends and application scenario of the terahertz communication system in the future based on terahertz chip technology. [Results] Terahertz discrete devices based on Schottky diodes, such as frequency multiplier and mixer, are developing towards high frequency band, large bandwidth, and high integration. Regarding to terahertz chips, chips based on InP, GaAs, GaN, and silicon technology are developing towards high power, high frequency, and high integration, while it is expected to form a pattern of coordinated development of InP and GaN process in the future. [Conclusions] In the future, the terahertz communication system based on chip technology can develop towards large-scale frequency division multiplexing (FDM), large-scale MIMO, inductive communication integration, photoelectric fusion, and complex multiplexing system integrating technologies such as FDM and polarization multiplexing. We also hope to discuss and imagine the development trend of terahertz chips and the development direction of communication systems based on terahertz chip technology.

Key words: Terahertz communication, Terahertz chip, Terahertz communication system, Frequency division multiplexing (FDM), Large-scale MIMO, Inductive communication integration, Photoelectric fusion, Complex multiplexing system

曹浩一,董亚洲,王正,寇伟,张倩玉,童钦文,杨自强,龚森,曾泓鑫,张雅鑫. 太赫兹通信芯片关键技术与系统发展浅析[J]. 数据与计算发展前沿, 2021, 3(5): 82-97.

CAO Haoyi,DONG Yazhou,WANG Zheng,KOU Wei,ZHANG Qianyu,TONG Qinwen,YANG Ziqiang,GONG Sen,ZENG Hongxin,ZHANG Yaxin. Analysis of Key Technology of Terahertz Communication Chip and Development of Communication System[J]. Frontiers of Data and Computing, 2021, 3(5): 82-97.

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时间	系统类型	系统技术特点	中心频率/GHz	通信速率/Gbps	通信距离/m	参考文献
2017	微波光子学	2×2MIMO,PDM ,16CAP	141	352	0.2	[39]
2019	微波光子学	4×4MIMO,PDM, FDM,PS,64QAM	124.5-150.5	1056	3.1	[32]
2020	微波光子学	PDM,OFDM,PS ,64QAM	320-380	600	2.8	[33]

太赫兹通信芯片关键技术与系统发展浅析

Analysis of Key Technology of Terahertz Communication Chip and Development of Communication System

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时间	系统类型	中心频率	通信速率/Gbps	通道数	其他复用方式	参考文献
2013	微波光子学	225GHz、237.5GHz 250GHz	100	3	\	[30]
2016	微波光子学	300-500GHz（间隔25GHz）	160	8	\	[31]
2019	微波光子学	124.5-150.5GHz	1056	4	4×4MIMO,PDM,	[32]
2020	微波光子学	320GHz、380GHz	600	2	PDM	[33]