数据与计算发展前沿 ›› 2021, Vol. 3 ›› Issue (5): 40-54.

doi: 10.11871/jfdc.issn.2096-742X.2021.05.003

• 专刊：我国信息技术领域“卡脖子”问题与对策 • 上一篇    下一篇

专利分析视角下我国集成电路产业“卡脖子”问题研究

余丽1(),盛莹婕1,*(),许景龙2(),隋秀峰1()   

  1. 1.北京理工大学,中国工程科技前沿交叉战略研究中心,北京 100081
    2.中共广东省党校（广东行政学院）图书馆,广东 广州 510053
  • 收稿日期:2021-09-29 出版日期:2021-10-20 发布日期:2021-11-24
  • 通讯作者: 盛莹婕
  • 作者简介:余丽,北京理工大学中国工程科技前沿交叉战略研究中心,博士,副研究员,主要从事技术预见、知识图谱等研究。
    本文主要承担集成电路关键技术专利调研和产业发展分析。
    YU Li, Ph.D., is an associate professor at the Center for Stra-tegic Research on Frontier and Interdisciplinary Engine-ering Science and Technology, Beijing Institute of Technology. Her main research interests include technology prediction and knowledge graphs.
    In this paper, she is mainly responsible for the patent investigation and industry development analysis of IC key tech-nologies.
    E-mail: yul@bit.edu.cn|盛莹婕,北京理工大学中国工程科技前沿交叉战略研究中心,硕士,研究实习员,主要从事科技创新政策与战略新兴产业发展研究。
    本文主要承担集成电路关键技术文献调研。
    SHENG Yingjie, master’s degree, is an assistant research fellow at the Center for Strategic Research on Frontier and Interdisciplinary Engineering Science and Technology, Beijing Institute of Technology. Her main research interests include information and technology innovation and policies, and development strategy of Emerging Industries.
    In this paper, she is mainly responsible for the IC technology literature research.
    E-mail: shengyingjie@bit.edu.cn|许景龙,中共广东省党校（广东行政学院）图书馆,硕士,助理馆员,主要从事专利分析研究。
    本文主要承担集成电路领域专利分析实验。
    XU Jinglong, master’s degree, is an assistant librarian at the Library of Party School of the Guangdong Provincial Committee of CPC (Guangdong Institute of Public Admin-istration). His research interests include patent analysis.
    In this paper, he is mainly responsible for the patent analysis experiments on IC.
    E-mail: xjl@gddx.gov.cn|隋秀峰,北京理工大学中国工程科技前沿交叉战略研究中心,博士,研究员,主要从事网络安全、社会治理等战略研究。
    本文主要承担集成电路领域对策建议分析。
    SUI Xiufeng, Ph.D., is a full professor at the Center for Stra-tegic Research on Frontier and Interdisciplinary Engin-eering Science and Technology, Beijing Institute of Techn-ology. His main research interests include policy research on cyber security and social governance.
    In this paper, he is mainly responsible for the policy analysis on IC industries.
    E-mail: suixiufeng@bit.edu.cn
  • 基金资助:
    国家自然科学基金(41801320);国家重点研发计划重点专项(2020YFC0832601)

A Study on the Bottlenecks Technologies of Integrated Circuit Industry in China from the Patent Analysis Perspective

YU Li1(),SHENG Yingjie1,*(),XU Jinglong2(),SUI Xiufeng1()   

  1. 1. Center for Strategic Research on Frontier and Interdisciplinary Engineering Science and Technology, Beijing Institute of Technology, Beijing 100081, China
    2. Library of Party School of the Guangdong Provincial Committee of CPC (Guangdong Institute of Public Administration), Guangzhou, Guangdong 515300, China
  • Received:2021-09-29 Online:2021-10-20 Published:2021-11-24
  • Contact: SHENG Yingjie

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摘要：

【目的】剖析当前我国集成电路发展的主要问题,提出技术创新的对策建议。【文献范围】53篇学术论文、行业研究报告和新闻报道,IncoPat专利数据库。【方法】综合运用文献调研、专利分析、专家研判多种方法,围绕集成电路产业链的材料、设计、制造与封测四个环节,开展技术自给能力分析与国际差距对比研究。【结果】我国在集成电路材料领域的高价值专利占比持续攀升,设计领域核心技术积累不足,制造领域技术创新稳步前行,封装与测试领域创新效能降低。【局限】专利检索策略不同得出的结果可能不同。【结论】我国集成电路领域存在“原始创新能力不足、核心技术积累匮乏、市场集中度不高”的问题,建议以开放式创新思维积极融入国际创新网络,突破潜在颠覆性技术实现关键技术自主可控,借助新兴产业蓬勃发展契机培育壮大国内市场。

关键词: 集成电路, 关键技术, 卡脖子技术, 颠覆性技术, 科技创新

Abstract:

[Objective] This paper aims to analyze the main problems in the current IC development in China and make recommendations for technological innovation. [literature Scope] 53 documents including academic papers, industrial research reports and newspapers, and IncoPat patent database are studied. [Methods] In this paper, we use multiple methods such as literature research, patent analysis, and expert analysis to conduct the study, focusing on the key elements of the IC industry chain: materials, design, manufacturing, and packaging/testing. A comparative study on technological self-sufficiency and gaps to the international level is carried out. [Results] We found that the share of the high-value patents in the field of materials is rising; the accumulation of core technologies in the field of design is insufficient; the technology innovation in the field of manufacturing is being promoted steadily, and the efficiency of innovation in the field of packaging and testing is declining. [limitations] The patent analysis results obtained by different search strategies may be different. [Conclusions] The main problems in the China’s IC development are identified, including “insufficient capacity for original innovation, lack of core technology accumulation; and low market concentration”. We recommend more active participation in the global innovation network with open and innovative thinking, striving for breakthroughs in potential disruptive technologies and ensuring the safety of key technologies, and taking the opportunity of emerging industry development to cultivate and expand the domestic market.

Key words: Integrated circuit, key technologies, technology bottlenecks, disruptive technologies, scientific and technological innovation