Frontiers of Data and Domputing ›› 2021, Vol. 3 ›› Issue (5): 40-54.doi: 10.11871/jfdc.issn.2096-742X.2021.05.003

• Special Issue: Problems and Counter measures in the field of In fomation Tellnology in China • Previous Articles     Next Articles

A Study on the Bottlenecks Technologies of Integrated Circuit Industry in China from the Patent Analysis Perspective

YU Li1(),SHENG Yingjie1,*(),XU Jinglong2(),SUI Xiufeng1()   

  1. 1. Center for Strategic Research on Frontier and Interdisciplinary Engineering Science and Technology, Beijing Institute of Technology, Beijing 100081, China
    2. Library of Party School of the Guangdong Provincial Committee of CPC (Guangdong Institute of Public Administration), Guangzhou, Guangdong 515300, China
  • Received:2021-09-29 Online:2021-10-20 Published:2021-11-24
  • Contact: SHENG Yingjie E-mail:yul@bit.edu.cn;shengyingjie@bit.edu.cn;shengyingjie@bit.edu.cn;xjl@gddx.gov.cn;suixiufeng@bit.edu.cn

Abstract:

[Objective] This paper aims to analyze the main problems in the current IC development in China and make recommendations for technological innovation. [literature Scope] 53 documents including academic papers, industrial research reports and newspapers, and IncoPat patent database are studied. [Methods] In this paper, we use multiple methods such as literature research, patent analysis, and expert analysis to conduct the study, focusing on the key elements of the IC industry chain: materials, design, manufacturing, and packaging/testing. A comparative study on technological self-sufficiency and gaps to the international level is carried out. [Results] We found that the share of the high-value patents in the field of materials is rising; the accumulation of core technologies in the field of design is insufficient; the technology innovation in the field of manufacturing is being promoted steadily, and the efficiency of innovation in the field of packaging and testing is declining. [limitations] The patent analysis results obtained by different search strategies may be different. [Conclusions] The main problems in the China’s IC development are identified, including “insufficient capacity for original innovation, lack of core technology accumulation; and low market concentration”. We recommend more active participation in the global innovation network with open and innovative thinking, striving for breakthroughs in potential disruptive technologies and ensuring the safety of key technologies, and taking the opportunity of emerging industry development to cultivate and expand the domestic market.

Key words: Integrated circuit, key technologies, technology bottlenecks, disruptive technologies, scientific and technological innovation