Frontiers of Data and Domputing ›› 2021, Vol. 3 ›› Issue (5): 82-97.doi: 10.11871/jfdc.issn.2096-742X.2021.05.006

• Special Issue: Problems and Counter measures in the field of In fomation Tellnology in China • Previous Articles     Next Articles

Analysis of Key Technology of Terahertz Communication Chip and Development of Communication System

CAO Haoyi1(),DONG Yazhou1(),WANG Zheng1(),KOU Wei1(),ZHANG Qianyu1(),TONG Qinwen1(),YANG Ziqiang1,2(),GONG Sen1,2(),ZENG Hongxin1(),ZHANG Yaxin1,2,*()   

  1. 1. University of Electronic Science and Technology of China, Chengdu, Sichuan 611731, China
    2. Yangtze Delta Region Institute (Huzhou), University of Electronic Science and Technology of China, Huzhou, Zhejiang 313099, China
  • Received:2021-10-01 Online:2021-10-20 Published:2021-11-24
  • Contact: ZHANG Yaxin E-mail:2018120708028@std.uestc.edu.cn;514953505@qq.com;627620644@qq.com;1973877445@qq.com;qyzhang6@163.com;tonqw@outlook.com;yangziqiang@uestc.edu.cn;gongsen@uestc.edu.cn;zhangyaxin@uestc.edu.cn

Abstract:

[Objective] With the increasing shortage of low-frequency spectrum resources in modern wireless communication, the terahertz band which is rich in spectrum resources and terahertz communication which has larger bandwidth and higher confidentiality have shown their advantage. It has become the key candidate of the next generation wireless communication technology with its core in terahertz chip. [Methods] This paper mainly introduces terahertz chip technology and chip-based communication technology. We will start from the key terahertz chips and devices, analyzing the existing achievements and future development trend of discrete devices based on Schottky diode chips, like mixer and frequency multiplier, to terahertz chips and consider the technical development trends and application scenario of the terahertz communication system in the future based on terahertz chip technology. [Results] Terahertz discrete devices based on Schottky diodes, such as frequency multiplier and mixer, are developing towards high frequency band, large bandwidth, and high integration. Regarding to terahertz chips, chips based on InP, GaAs, GaN, and silicon technology are developing towards high power, high frequency, and high integration, while it is expected to form a pattern of coordinated development of InP and GaN process in the future. [Conclusions] In the future, the terahertz communication system based on chip technology can develop towards large-scale frequency division multiplexing (FDM), large-scale MIMO, inductive communication integration, photoelectric fusion, and complex multiplexing system integrating technologies such as FDM and polarization multiplexing. We also hope to discuss and imagine the development trend of terahertz chips and the development direction of communication systems based on terahertz chip technology.

Key words: Terahertz communication, Terahertz chip, Terahertz communication system, Frequency division multiplexing (FDM), Large-scale MIMO, Inductive communication integration, Photoelectric fusion, Complex multiplexing system